Back to Samtec

Samtec COM-HPC™ Interconnect Solutions

Samtec COM-HPC™ Interconnect Solutions offer up to 300W power rating, 400 total pins, and up to 32Gbps per channel. COM-HPC solutions provide ultra-high-speed performance and extended connectivity with limitless scalability, ensuring to meet the growing demands. These high-density interconnecting systems meet the COM-HPC standard for high-performance Computer-on-Modules. Samtec COM-HPC Interconnect Solutions are ideal for medical imaging, embedded edge servers, 5G connected vehicles, 5G wireless infrastructure, and industrial applications.

Applications

  • Datacom and telecom
  • Embedded edge servers
  • Industrial
  • Medical imaging
  • 5G wireless infrastructure
  • 5G connected vehicles

Specifications

  • Up to 32Gbps per channel
    • 4096Gbps max aggregate
    • 2088Gbps per square inch
  • PCIe® Gen 4/5 compliant
  • 10G/25G Ethernet compliant
  • Up to 300W at 11.4V to 12.6V

Videos

Additional Resources

Related Solutions

Samtec Industry Standards Solution

Improves compatibility, performance, and efficiency.

Learn Moreabout Samtec Industry Standards Solution View Productsrelated to Samtec Industry Standards Solution
Published: 2021-05-20 | Updated: 2026-02-03