LEU Incoterms:DDP All prices include duty and customs fees on select shipping methods. Free shipping on most orders over 210 RON (RON) Payment accepted in Credit cards only
Euros Incoterms:DDP All prices include duty and customs fees on select shipping methods. Free shipping on most orders over 50 € (EUR) All payment options available
US Dollars Incoterms:DDP All prices include duty and customs fees on select shipping methods. Free shipping on most orders over $60 (USD) All payment options available
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TS391 No-Clean Solder Paste
Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.
