DA14706-00000HZ2

Renesas / Dialog
724-DA14706-00000HZ2
DA14706-00000HZ2

Mfr.:

Description:
RF System on a Chip - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Datasheet:
ECAD Model:
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Learn more about Renesas / Dialog DA14706-00000HZ2

In Stock: 3.206

Stock:
3.206 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 3206 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- RON
Ext. Price:
-,-- RON
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (RON)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
58,35 RON 58,35 RON
48,34 RON 483,40 RON
45,12 RON 1.128,00 RON
41,25 RON 4.125,00 RON
39,18 RON 9.795,00 RON
38,03 RON 19.015,00 RON
37,32 RON 37.320,00 RON
Full Reel (Order in multiples of 4000)
37,32 RON 149.280,00 RON
† A MouseReel™ fee of 29,00 RON will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Renesas Electronics
Product Category: RF System on a Chip - SoC
RoHS:  
Bluetooth
ARM Cortex M33
2.4 GHz
6 Mbps
6 dBm
- 97 dBm
2.9 V
4.75 V
1.85 mA
3 mA
4 kB, 32 kB
- 40 C
+ 85 C
VFBGA-142
Reel
Cut Tape
MouseReel
Brand: Renesas / Dialog
Data RAM Size: 1.5 MB
Maximum Clock Frequency: 160 MHz, 2.4 GHz
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Number of I/Os: 79 I/O
Product Type: RF System on a Chip - SoC
Series: DA14706
Factory Pack Quantity: 4000
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
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Attributes selected: 0

Datasheet

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CNHTS:
8542319092
USHTS:
8542310070
ECCN:
5A992.C

DA14706 Highly Integrated Advanced Wireless MCU

Renesas / Dialog DA14706 Highly Integrated Advanced Wireless MCU has integrated application processors, 2D Graphics processors, Voice Activity Detector (VAD), and Power Management Unit (PMU).  It's the only product in the BLUETOOTH® LE space to offer this level of integration. This allows for cost-effective and reliable form factor designs for complex sensor and graphical processing applications.

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