LPS27HHWTR

STMicroelectronics
511-LPS27HHWTR
LPS27HHWTR

Mfr.:

Description:
Board Mount Pressure Sensors MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with water

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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
4.992
Expected 12/14/2026
Factory Lead Time:
24
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- RON
Ext. Price:
-,-- RON
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2500)

Pricing (RON)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
15,69 RON 15,69 RON
14,08 RON 70,40 RON
13,43 RON 134,30 RON
12,73 RON 318,25 RON
12,22 RON 611,00 RON
11,77 RON 1.177,00 RON
10,81 RON 5.405,00 RON
10,46 RON 10.460,00 RON
Full Reel (Order in multiples of 2500)
9,96 RON 24.900,00 RON
† A MouseReel™ fee of 29,00 RON will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
STMicroelectronics
Product Category: Board Mount Pressure Sensors
RoHS:  
Absolute
26 kPa to 126 kPa
100 Pa
Digital
SMD/SMT
I2C, SPI
1.7 V to 3.6 V
No Port
24 bit
- 40 C
+ 85 C
LPS27HHW
Reel
Cut Tape
MouseReel
Brand: STMicroelectronics
Moisture Sensitive: Yes
Product Type: Board Mount Pressure Sensors
Factory Pack Quantity: 2500
Subcategory: Sensors
Supply Voltage - Max: 3.6 V
Supply Voltage - Min: 1.7 V
Unit Weight: 18,850 mg
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Attributes selected: 0

TARIC:
9026208090
CNHTS:
8542391090
USHTS:
8542390090
ECCN:
EAR99

LPS27HHW MEMS Pressure Sensor

STMicroelectronics LPS27HHW MEMS Pressure Sensor is an ultra-compact piezoresistive sensor that functions as a digital output barometer. STMicroelectronics LPS27HHW comprises a sensing element and an IC interface communicating through I2C, MIPI I3CSM, or SPI. The sensing element detects absolute pressure and consists of a suspended membrane manufactured using a dedicated process developed by ST.

MEMS Pressure Sensors

STMicroelectronics MEMS Pressure Sensors use innovative MEMS technology to provide extremely high-pressure resolution, in ultra-compact and thin packages. The devices are designed using ST's VENSENS technology, allowing the fabrication of pressure sensors on a monolithic silicon chip. This eliminates wafer-to-wafer bonding and maximizes reliability.