CPL2512TR68M

TDK
810-CPL2512TR68M
CPL2512TR68M

Mfr.:

Description:
RF Inductors - SMD 2512 0.68uH 20% 2.5x1.5x1.2mm

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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1   Multiples: 1
Unit Price:
-,-- RON
Ext. Price:
-,-- RON
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (RON)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
1,56 RON 1,56 RON
1,31 RON 13,10 RON
1,20 RON 30,00 RON
0,976 RON 97,60 RON
0,92 RON 230,00 RON
0,699 RON 699,00 RON
Full Reel (Order in multiples of 2000)
0,694 RON 1.388,00 RON
0,674 RON 2.696,00 RON
0,619 RON 6.190,00 RON
† A MouseReel™ fee of 29,00 RON will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
TDK
Product Category: RF Inductors - SMD
RoHS:  
Wirewound
2.5 mm x 1.5 mm x 1 mm
Shielded
680 nH
20 %
1.4 A
77 mOhms
- 40 C
+ 105 C
Standard
2.5 mm
1.5 mm
1 mm
CPL
Reel
Cut Tape
MouseReel
Application: Power
Brand: TDK
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 2000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Unit Weight: 198 mg
Products found:
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Attributes selected: 0

TARIC:
8504500090
CNHTS:
8504500000
CAHTS:
8504500000
USHTS:
8504508000
JPHTS:
8504500001
KRHTS:
8504509090
MXHTS:
8504509102
BRHTS:
85045000
ECCN:
EAR99

CPL SMD Inductor Coil for Power Lines

TDK CPL2512 SMD Inductor Coil for Power Lines is wound, magnetically shielded, and completely lead-free. The inductor delivers low Rdc with high ldc and is able to withstand high-temperature reflows (260°C during peak) used in lead-free soldering. Ideal applications for the CPL component is portable audio-visual devices (DSCs, DVCs, etc.), mobile communication devices (cellular phones), and information devices (PCs, etc.).

Power Inductors

TDK Power Inductors include commercial- and automotive-grade models for power applications. These inductors are offered in a broad range of options such as low-profile, compact, magnetically-shielded, lead-free, and more. Among these designs are models with characteristics such as low hum noise, high Q, narrow inductance tolerance, loss reduction, low DCR, and large-current capability. TDK Power Inductors are available in wirewound, multilayer, and thin-film technologies and are designed to suit various needs.

Inductors

TDK Inductors are manufactured using state-of-the-art multilayer processing technologies, wire-winding technology, or thin-film technologies. TDK's unique multilayer processing technology provides higher inductance and Q characteristics as well as further miniaturisation. The portfolio includes a wide spectrum of filters, SMT inductors, power inductors, transponder coils and line reactors. These components are designed for use in high-frequency, signal, and power circuits. TDK Inductors are ideal for a range of applications including mobile devices, consumer electronics, solar power inverters, power supplies, on-board chargers, and automobile systems.

PoE - Power over Ethernet Applications & Solutions

TDK PoE - Power over Ethernet Applications and Solutions feature TDK's expanded line of ALT series SMD pulse transformers to be used in combination with ACM and MCZ series common-mode filters. These are used in various PoE applications that are compatible with 1G/2.5G/5G/10GBASE-T, 10/100/1000BASE-T, and PoE+ (600mA) standards. PoE is a technology that allows electrical power and data transmission to be carried simultaneously through a single cable versus through a separate power cord and network cable. PoE reduces the number of cables and wires necessary for installation and allows for design flexibility, as device placement no longer relies on the availability of an electrical outlet. PoE is capable of supporting higher transmission speeds while still providing outstanding reliability and meeting compact design targets. TDK PoE - Power over Ethernet Applications and Solutions allow for greater scalability as the number of connected devices and LAN interfaces on each device continues to grow and more electronic components are used in servers and routers, as well as in other network and communication devices. 

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