ILPS22QSTR

STMicroelectronics
511-ILPS22QSTR
ILPS22QSTR

Mfr.:

Description:
Board Mount Pressure Sensors Dual full-scale 1260hPa 4060hPa absolute digital output barometer embedded Qvar
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
12.678
Expected 4/28/2026
Factory Lead Time:
45
Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 300
Unit Price:
-,-- RON
Ext. Price:
-,-- RON
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 8000)

Pricing (RON)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
15,34 RON 15,34 RON
13,23 RON 66,15 RON
12,17 RON 121,70 RON
10,76 RON 538,00 RON
10,16 RON 1.016,00 RON
Full Reel (Order in multiples of 8000)
10,16 RON 81.280,00 RON
† A MouseReel™ fee of 29,00 RON will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
STMicroelectronics
Product Category: Board Mount Pressure Sensors
RoHS:  
Absolute
26 kPa to 406 kPa
Digital
SMD/SMT
I2C, SPI
LGA-10
- 40 C
+ 105 C
Reel
Cut Tape
MouseReel
Brand: STMicroelectronics
Moisture Sensitive: Yes
Operating Supply Current: 11.7 uA
Product Type: Board Mount Pressure Sensors
Factory Pack Quantity: 8000
Subcategory: Sensors
Supply Voltage - Max: 3.6 V
Supply Voltage - Min: 1.7 V
Unit Weight: 7 mg
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TARIC:
9026208090
CNHTS:
8542391090
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

ILPS22QS Absolute Digital Output Barometer

STMicroelectronics ILPS22QS Absolute Digital Output Barometer is an ultra-compact piezoresistive absolute pressure sensor that operates as a digital output barometer. The ILPS22QS supports dual full-scale up to user-selectable 4060hPa. The ILPS22QS features ultra-low pressure noise with very low power consumption.

MEMS Pressure Sensors

STMicroelectronics MEMS Pressure Sensors use innovative MEMS technology to provide extremely high-pressure resolution, in ultra-compact and thin packages. The devices are designed using ST's VENSENS technology, allowing the fabrication of pressure sensors on a monolithic silicon chip. This eliminates wafer-to-wafer bonding and maximizes reliability.

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